100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thickness: 0.1mm
100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thickness: 0.1mm
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R96.74/mo 3 months
- R48.92/mo 6 months
- R25.82/mo 12 months
- From R96.74/month over 3 months, or as low as R25.82/month over 12. Total repayable over 12 months: R309.84. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
6-13 business days
In Stock CHN
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Description
100 pieces of red copper thermal cooling pads are designed for heat dissipation in Android smartphone CPUs. They are used after chip reballing or motherboard maintenance to prevent overheating.
- Material: Oxygen-free pure copper
- Dimensions: 12.4mm x 14mm
- Thickness: 0.1mm
- Quantity: 100 pieces
- Function: Heat dissipation for Android smartphone CPUs
- Application: Used after chip reballing or motherboard maintenance
- Compatibility: Suitable for various Android smartphone models
- Replaces damaged OEM thermal materials
- Reduces risk of device failure due to inadequate cooling
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