AMAOE 0.12mm Reballing Stencil For iPhone 14 Series

SKU: EDA008186205
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Regular price R 249.00
Regular price Sale price R 249.00
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Description

BGA stencil designed for reballing IC chips in iPhone 14 Series devices. It provides precise alignment and improves reballing efficiency for high-precision repairs.

  • Product Type: BGA Stencils
  • Compatibility: iPhone 14 Series
  • Material: Stainless Steel
  • Design: Ultra-thin, 0.12mm
  • Color: Silver
  • Intended Use: High-precision IC chip repairs
  • Heat Resistance: Excellent
  • Corrosion Resistance: Excellent
  • Durability: Highly durable and wear-resistant
  • Cleaning: Easy to clean
  • Reuse Cycles: Capable of withstanding hundreds of cycles
  • Cutting Technology: Laser micron-level cutting
  • Aperture Sizes: Uniform
  • Solder Ball Alignment: Highly accurate
  • Operation: Quick and easy
  • Efficiency: Improves reballing efficiency and reduces rework rates
  • Application: Suitable for individual technicians and professional mass production environments
  • Cost-Effectiveness: Lowers repair costs

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